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In today’s high-tech manufacturing landscape, critical industries such as semiconductors, electronics, die casting, lithium batteries, and food safety face increasing challenges: Unicomp Reveals for the First Time: The Secrets Behind Its Self-Developed X-Ray Source The X-ray tube source — the “heart” of industrial inspection — has long been dominated by foreign manufacturers. This dependence has hindered China’s advancements in semiconductor nano-defect detection and new energy battery quality control, becoming a critical bottleneck in high-precision manufacturing. Now, for the first time, Unicomp Technology unveils the full journey from R&D to mass production of its self-developed X-ray sources. After a decade of relentless innovation, Unicomp has successfully developed a full range of self-produced 90–180kV closed-tube thermionic microfocus X-ray sources. These are now in mass production and being globally deployed, casting light into every corner of intelligent manufacturing. 1.) Unveiling the Core Technologies Four Breakthrough Core Technologies: The UNMS series X-ray sources utilize sophisticated mathematical models and simulations (electric/magnetic fields, thermodynamics) to optimize X-ray generation processes. This forms the technological backbone for high-precision industrial applications. The R&D process spans complex fields: atomic physics, vacuum science, materials engineering, electromagnetics, electron optics, and thermal processing. For instance, rare earth materials—critical to performance—pose challenges due to their structural sensitivity and scarcity, requiring cross-disciplinary breakthroughs in material design and substitution. 2.) The Trillion-Electron-Volt Production Journey At Unicomp, mass production only begins when the yield rate reaches 100%. With an internal penetration rate exceeding 95%, over 5,000 units of the UNMS series have been delivered globally—earning high praise for exceeding the performance of imported models. Mass production required overcoming key challenges in material purity, precision manufacturing, and vacuum sustainability—supported by 100+ tightly controlled process checkpoints. Custom-built high-end equipment—including ultra-high vacuum systems and laser cutters—supports Unicomp’s smart, standardized production line for high-precision tube sources. Precision Assembly Highlights: Each X-ray source includes an integrated digital control module with software interface, enabling real-time monitoring of power, temperature, and error diagnostics, and ensuring safety interlocks with inspection systems. 3.) A Rare Full-Chain R&D Team Unicomp has cultivated a world-class R&D team of nearly 200 professionals, with R&D investment exceeding 11% of annual revenue. The team covers the full value chain of X-ray source development—one of the few such capabilities globally. Unicomp actively participates in national-level science and technology initiatives (e.g., “02 Program,” “863 Program,” and Major Instrument Projects by the Ministry of Science and Technology) and has led the drafting of multiple national and industry standards. The company holds over 500 domestic and international patents. The team has now mastered core technologies such as glass-ceramic substrate modification and rare-earth metal infiltration, supporting large-scale production of 90–180kV microfocus sources. 4.) A Full-Scale Intelligent Inspection Ecosystem From breaking foreign monopolies to achieving international leadership, the story of Unicomp’s X-ray source is a tale of a decade-long journey to domestic innovation—and a driving force in intelligent manufacturing. By integrating “X-ray source + AI algorithm + inspection platform,” Unicomp has built a full-stack industrial inspection ecosystem. The internally closed-loop system ensures 100% zero-defect quality in every new-generation tube that enters the market. With AI-driven precision, Unicomp’s technology powers inspection from nanometer-scale wafers to multi-ton automotive castings. Applications span: It is also expanding into food, aerospace, and pharmaceutical safety—becoming an essential driver of high-end intelligent manufacturing. 5.) Advancing the Frontiers of Imaging Looking ahead, Unicomp will continue to focus on X-ray source innovation with several key goals: After 5 years of focused development, Unicomp has achieved batch production of nanofocus open-tube X-ray sources, which are gaining strong traction among semiconductor and IC clients.(Open-tube sources maintain vacuum with an external pump and offer smaller focal spots than closed tubes—better suited for high-end research and detection.) 6.) Embarking on a Global Mission Rooted in full-stack self-development, Unicomp has achieved complete autonomy over materials, processes, and production equipment, covering the entire industrial chain for high-performance X-ray sources. Its strategic roadmap now focuses on: Through a global manufacturing network and multi-modal technology integration, Unicomp is emerging as a world-class leader in high-precision industrial inspection, reshaping China’s global competitiveness in advanced equipment. “From solitary breakthroughs in the lab to the full force of mass production, a beam of light cuts through.What we see is not just a defect, but the backbone of a nation’s industrial might.The light forged by a thousand trials now becomes the eternal fire that illuminates the future of Chinese manufacturing.”

July 16, 2025 – The 19th Shanghai International Die Casting and Nonferrous Foundry Exhibition officially opened at the Shanghai New International Expo Centre. As a premier global event in the die casting industry, the exhibition brings together cutting-edge technologies and groundbreaking innovations from around the world. 01 Addressing Industry Pain Points | Breaking Through Internal Defect Detection Barriers During the die casting process, accurate detection of internal defects—such as porosity, shrinkage, and cracks—is critical for ensuring product quality. However, this remains a recognized technical challenge in the industry. Traditional inspection methods have notable limitations: 02 Intelligent CT Solution | A Full-Stack Detection Approach Ray Tech Malaysia’s parent company, Unicomp Technology Group’s showcased solution integrates high-precision X-ray computed tomography (CT) with AI-driven algorithms, offering the following core capabilities: 2.1 3D Imaging Visualization Using high-resolution X-ray scanning, the system rapidly reconstructs a complete 3D model of the workpiece’s internal structure. It clearly visualizes various internal defects—such as porosity, inclusions, and cracks—while accurately locating them in 3D space. 03 Technology Showcase Draws Attention | Dynamic On-Site Engagement On the opening day, Unicomp Technology Group’s booth attracted a large number of technical professionals and decision-makers across the die casting supply chain. The technical team engaged in in-depth discussions with visitors, offering live equipment demonstrations and detailed explanations of application scenarios and pain point solutions. According to public information, Unicomp Technology has a strong track record in the X-ray inspection field, with over 600 core patents and intellectual property certifications. Its solutions are deployed in more than 70 countries and regions, with over 30,000 successful application cases to date. Unicomp Technology Group cordially invites all die casting professionals to connect and collaborate. We remain committed to advancing quality inspection technologies, helping manufacturers enhance precision and efficiency in quality control, and strengthening global competitiveness. Let’s explore innovations and shape the future of the industry—together.

The Malaysian International Food and Beverage Trade Fair (MIFB) 2025, Malaysia’s premier F&B trade event, returns from 30 July to 1 August 2025 at the Kuala Lumpur Convention Centre. MIFB has established itself as a key platform for SMEs, startups, and innovators to showcase new products, breakthrough inventions, and cutting-edge solutions within the ASEAN food and beverage market. Ray Tech (Malaysia) Sdn Bhd, a subsidiary of UNICOMP Technology, will present its latest AI-based X-ray inspection systems designed specifically for the food and beverage industry. With a mission to empower emerging brands through visibility, buyer connections, and market expansion, MIFB continues to emphasize innovation in food technology, sustainability, and future-ready solutions. These efforts set the stage for the next wave of transformative developments in the F&B sector. As such, MIFB is a must-attend event for buyers, distributors, and investors seeking forward-thinking, disruptive brands shaping the future of food. In addition to fostering networking opportunities for both local and international businesses, MIFB 2025 will spotlight key innovations across the entire F&B supply chain—from raw ingredient sourcing to advanced packaging and distribution solutions. Key focus areas include the rising demand for Ready-To-Eat (RTE) and Ready-To-Cook (RTC) foods, as well as advancements in AI-driven technologies for smart manufacturing and sustainable packaging. Under the theme “Future-Ready F&B: Serving the Evolution of Food Trends,” UNICOMP Technology, an expert in AI-powered X-ray inspection, will showcase its cutting-edge food quality control systems at MIFB 2025. Thanks to its strong software development capabilities, UNICOMP has independently developed AI-based intelligent detection algorithms. These enable fast and precise detection of foreign objects in food, packaging, and more. Real-time data feedback supports automated, batch-based, and unmanned food quality monitoring. Featured equipment includes: Visit Us at MIFB 2025 Join us at Hall 4, Booth 4512 at the Malaysia International Food & Beverage Trade Fair 2025. X-ray foreign object detection plays a vital role in food and beverage quality assurance. UNICOMP Technology’s expertise in AI-driven detection algorithms ensures fast, accurate identification of contaminants—helping companies safeguard public health, meet safety standards, and maintain customer trust.

We are proud to witness another key milestone in our global journey — the official opening of Unicomp’s Chongqing Branch, further strengthening our footprint in China’s high-tech manufacturing hub. On the day of the opening ceremony, government representatives, industry experts, business partners, and supply chain stakeholders gathered to envision a shared future of Unicomp development. According to the Chairman of Unicomp Technology (Group), Dr. Liu stated that the commencement of operations at the Chongqing branch will provide stronger and more reliable technical support for quality control and safety inspections across various industries. With a global “3+3” industrial layout—three bases in China and three overseas—Unicomp is now poised for a new leap forward from this thriving land of Chongqing. CEO, Unicomp Technology (Group), Ye Jun Chao introduced the Chongqing Industrial Park, strategically located in Bishan, with a functional layout comprising:                •             Core Component Intelligent Manufacturing Zone                •             Flexible Production Lines                •             AI Inspection Laboratory                •             Supply Chain Collaboration Center The park focuses on high-end manufacturing, with production capacity for core products expected to grow rapidly, accompanied by significant technological iteration and breakthroughs in cutting-edge areas. Director, Unicomp Research Institute, Dr. Zhang presented several new products, highlighting advancements in core components, complete systems, and software, showcasing Unicomp’s forward-thinking R&D capabilities. The Bishan District government also introduced the current state and investment environment of Bishan’s industrial development. Unicomp Technology Group signed a strategic cooperation agreement with the Chongqing Institute for Advanced Energy Storage Materials and Equipment, led by Academician Pan Fusheng. Together, they will focus on cutting-edge fields such as:                •             High-performance lightweight materials                •             Magnesium-based energy storage materials                •             Next-generation battery technologies Highlights of the Chongqing Branch:                •             Total Area: Over 75,000 m²                •             Facilities: Provincial-level technology/engineering centers and academician workstations                •             Focus:                •             NDT (Non-Destructive Testing) solutions across the general industrial field                •             Cutting-edge technologies such as 3D/CT imaging, machine vision, AI, and image processing algorithms This will support Unicomp’s rapid business growth and its “multi-dimensional strategic upgrade.” Relying on Chongqing’s strong smart equipment manufacturing cluster, the base will synergize with upstream and downstream partners to build a closed-loop industrial ecosystem from: R&D → Scenario-Based Applications → Supply Chain Collaboration. This ecosystem aims to contribute to the formation of China’s intelligent inspection equipment industry circle, strengthening Unicomp’s market leadership and expanding its competitive edge. Currently, Unicomp Technology Group operates six major manufacturing and R&D centers worldwide, covering over 130,000 m² in total.