Category: Media

In today’s high-precision manufacturing environment, X-ray inspection is no longer optional—it’s a critical tool for ensuring product integrity, reliability, and compliance. From SMT and semiconductor to automotive and advanced electronics, the ability to detect hidden defects empowers manufacturers to make faster, smarter, and more accurate decisions. So, how do you choose between inline and offline inspection? INLINE X-ray Inspection — Speed, Automation & Scalability Designed for high-volume production, the Unicomp LX2000 delivers fully automated, real-time inspection directly within your production line. Key Highlights of LX2000: • High-speed inspection capability with rapid image acquisition of 0.4 seconds per image. • Fully automated inline system with conveyor integration for continuous inspection and maximum throughput • Intelligent auto inspection & OK/NG judgement with advanced algorithms • CNC programmable inspection for repeatability and consistency • Seamless MES/ERP/SPC connectivity for traceability and smart factory integration • Up to 200X magnification with large inspection area for complex components Ideal for: SMT lines, semiconductor packaging, PCBA, and high-speed manufacturing where efficiency and consistency are critical. OFFLINE X-ray Inspection — Precision, Flexibility & Deep Analysis For applications requiring deeper insight and engineering-level evaluation, the Unicomp AX8300S Plus offers powerful offline inspection capabilities. Key Highlights of AX8300S Plus: • High-resolution imaging enabled by a 5 µm focal spot X-ray tube, allowing detailed analysis of defects such as voids, cracks, porosity, and misalignment. • CNC-assisted positioning + manual control for precise targeting and inspection flexibility • Optimized for failure analysis, R&D, and process validation • Suitable for complex samples such as semiconductor packages, BGA, advanced PCBA, and precision metal parts • User-friendly interface with programmable recipes for repeatable inspection workflows Ideal for: Engineering labs, quality assurance teams, failure analysis, and low-to-mid volume production environments where inspection depth matters more than speed. At Unicomp Technology, we don’t just provide inspection systems—we deliver visibility beyond the surface, helping you ensure every product meets the highest quality standards.

Joy, laughter, and lots of good food! Our Hari Raya celebration at Ray Tech Malaysia was filled with festive spirit, bringing colleagues together as one big family. Moments like these remind us that strong teamwork goes beyond the workplace—it’s about connection, appreciation, and shared happiness.

From 25–27 March 2026, our parent company, Unicomp Technology (Group) Co., Ltd., proudly participated in Productronica China 2026 at the Shanghai New International Expo Centre, presenting next-generation inspection technologies for the rapidly evolving semiconductor industry. As chip manufacturing enters the new era, conventional 2D inspection is no longer sufficient to detect complex internal defects. The Unicomp AX9500 rises to the challenge with its advanced 3D CT X-ray inspection technology, delivering deep structural insight for high-value components. Key Features of the AX9500 include: 160kV open tube with 1µm focus spot for ultra-precise imaging High-resolution detection area using FPD technology 3D CT scanning system for true volumetric inspection CNC programming with high accuracy and repeatability Enhanced user-friendly navigation system Easy tracking function with multi-angle inspection With the AX9500, manufacturers can achieve higher yield, superior quality control, and confident inspection for advanced semiconductor devices.

On 24 March 2026, at the prestigious Shangri-La Hotel Kuala Lumpur, Ray Tech Malaysia’s sister company, SCPL Semiconductor Test & Inspection (SSTI), and Wuxi High-tech Zone officially marked a significant milestone with the signing of a high-end semiconductor inspection project. This collaboration represents a strong alignment of technological expertise, industrial resources, and regional strengths—laying the foundation for deeper strategic cooperation in advanced semiconductor inspection solutions. Together, the parties aim to accelerate innovation, enhance manufacturing capabilities, and contribute to the growth of a more resilient and globally competitive semiconductor ecosystem.

On March 23, the China International Semiconductor Packaging and Testing Conference 2026 was held in Shanghai, where Ray Tech Malaysia’s parent company, Unicomp Technology Group was honored with the “𝐁𝐞𝐬𝐭 𝐁𝐫𝐚𝐧𝐝𝐢𝐧𝐠 𝐀𝐰𝐚𝐫𝐝 𝐢𝐧 𝐀𝐝𝐯𝐚𝐧𝐜𝐞𝐝 𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫 𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠 𝐄𝐪𝐮𝐢𝐩𝐦𝐞𝐧𝐭.” This prestigious award is rigorously evaluated based on multiple criteria, including technological innovation, market influence, and customer satisfaction. It recognizes enterprises that have made outstanding contributions to technological advancement and ecosystem development within the semiconductor packaging and testing industry.

As we celebrate this joyous occasion, Ray Tech Malaysia extends our heartfelt appreciation to our valued clients, trusted distributors, and dedicated team members. May this festive season bring you and your loved ones peace, prosperity, and happiness. Thank you for your continuous support and partnership. 𝐌𝐚𝐚𝐟 𝐙𝐚𝐡𝐢𝐫 & 𝐁𝐚𝐭𝐢𝐧 Together, we look forward to achieving greater success in the year ahead.

Ray Tech’s AI-powered CT X-ray inspection enables non-destructive, high-resolution internal analysis of durians — covering flesh fullness, ripeness, segment identification, and defect detection. With automated reporting and data-driven classification, the system ensures consistent quality, improved throughput, and optimized yield. Ray Tech’s CT provides a one-stop solution for advanced durian inspection.

We are honored to share that Dr. Liu Jun, Chairman of Unicomp Technology Group, has been recognized as one of the “Innovative Leaders” in the 2025 Forbes China Leaders in Technology and Innovation Selection. This prestigious recognition highlights Dr. Liu’s visionary leadership and his dedication to advancing technological innovation in the field of industrial inspection and high-end X-ray technologies Under his leadership, Unicomp Technology Group continues to drive innovation, strengthen technological capabilities, and deliver advanced inspection solutions to industries worldwide. Congratulations to Dr. Liu Jun on this remarkable achievement.

Today we celebrate the strength, dedication, and achievements of women around the world. At Ray Tech Malaysia, we appreciate the incredible contributions of women who inspire innovation, drive progress, and make a meaningful impact every day. Let’s continue to support, empower, and uplift one another toward a brighter and more inclusive future.

We are pleased to announce that Ray Tech Malaysia Sdn Bhd’s parent company, Unicomp Technology Group, will be participating in 𝐏𝐫𝐨𝐝𝐮𝐜𝐭𝐫𝐨𝐧𝐢𝐜𝐚 𝐂𝐡𝐢𝐧𝐚 𝟐𝟎𝟐𝟔! 𝐃𝐚𝐭𝐞: 𝟐𝟓 – 𝟐𝟕 𝐌𝐚𝐫𝐜𝐡 𝟐𝟎𝟐𝟔 𝐕𝐞𝐧𝐮𝐞: 𝐒𝐡𝐚𝐧𝐠𝐡𝐚𝐢, 𝐂𝐡𝐢𝐧𝐚 𝐇𝐚𝐥𝐥: 𝐄𝟓 𝐁𝐨𝐨𝐭𝐡 𝐍𝐨: 𝟓𝟑𝟓𝟎 Join us at one of the leading international trade fairs for electronics development and production. Discover our latest AI-powered X-ray inspection solutions designed for SMT, semiconductor, automotive, die casting, and advanced manufacturing industries. What to expect at our booth: Live machine demonstrations Advanced industrial X-Ray inspection solutions Smart inspection powered by AI algorithms Professional consultation with our sales & technical team This is a great opportunity to explore how intelligent inspection technology can enhance your production quality, efficiency, and reliability. We warmly welcome all partners, customers, and industry professionals to visit us. Let’s connect and explore future collaboration opportunities! Feel free to contact us to schedule a meeting in advance.