The industry is moving toward Advanced IC Packagingโwhere chips are becoming more compact, complex, and performance-intensive than ever before.
๐๐ก๐ ๐๐ก๐๐ฅ๐ฅ๐๐ง๐ ๐: ๐๐๐๐ข๐ง๐ ๐ญ๐ก๐ ๐๐ง๐ฌ๐๐๐ง 
With advanced multi-layered structures and high-density interconnects, internal defects are no longer visible to the naked eye or conventional inspection methods. Hidden killers like solder voids, micro-cracks, and internal delamination can compromise the reliability of next-gen tech if left undetected.
In this new era, quality assurance isn’t just a final step; itโs a core competitive advantage. Let’s introduce Unicomp’s Industrial AI-powered inspection equipment, AX9600 to you.
Key Technical Specs:
โข 160kV Open-Tube Technology: Penetrate dense materials with ease.
โข 1ฮผm Focal Spot Resolution: Detect even the most minute anomalies in TSV structures and wafer bump interconnects.
โข Up to 1500X Geometric Magnification: Crystal-clear visualization of internal architectures.
๐๐๐๐ฎ๐ซ๐ข๐ง๐ ๐๐๐ฅ๐๐ฒ๐ฌ๐ข๐โ๐ฌ ๐๐ฉ๐จ๐ญ ๐จ๐ง ๐ญ๐ก๐ ๐๐ฅ๐จ๐๐๐ฅ ๐๐ญ๐๐ ๐
As Malaysia evolves into a higher-value semiconductor hub, integrating advanced inspection solutions like the AX9600 ensures our local manufacturing remains precise, reliable, and globally competitive.
We aren’t just part of the supply chain; we are enabling the high-performance chip architectures of tomorrow.