𝐁𝐞𝐬𝐭 𝐁𝐫𝐚𝐧𝐝𝐢𝐧𝐠 𝐀𝐰𝐚𝐫𝐝 𝐢𝐧 𝐀𝐝𝐯𝐚𝐧𝐜𝐞𝐝 𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫 𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠 𝐄𝐪𝐮𝐢𝐩𝐦𝐞𝐧𝐭

On March 23, the China International Semiconductor Packaging and Testing Conference 2026 was held in Shanghai, where Ray Tech Malaysia’s parent company, Unicomp Technology Group was honored with the “𝐁𝐞𝐬𝐭 𝐁𝐫𝐚𝐧𝐝𝐢𝐧𝐠 𝐀𝐰𝐚𝐫𝐝 𝐢𝐧 𝐀𝐝𝐯𝐚𝐧𝐜𝐞𝐝 𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫 𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠 𝐄𝐪𝐮𝐢𝐩𝐦𝐞𝐧𝐭.”

This prestigious award is rigorously evaluated based on multiple criteria, including technological innovation, market influence, and customer satisfaction.

It recognizes enterprises that have made outstanding contributions to technological advancement and ecosystem development within the semiconductor packaging and testing industry.