Ray Tech

๐๐„๐๐‚๐Ž๐ ๐€๐’๐ˆ๐€ ๐Ÿ๐ŸŽ๐Ÿ๐Ÿ“ | ๐”๐ง๐ข๐œ๐จ๐ฆ๐ฉ ๐”๐ง๐ฏ๐ž๐ข๐ฅ๐ฌ ๐๐ž๐ฑ๐ญ-๐†๐ž๐ง๐ž๐ซ๐š๐ญ๐ข๐จ๐ง ๐€๐ˆ + ๐—-๐ซ๐š๐ฒ ๐ˆ๐ง๐ญ๐ž๐ฅ๐ฅ๐ข๐ ๐ž๐ง๐ญ ๐ˆ๐ง๐ฌ๐ฉ๐ž๐œ๐ญ๐ข๐จ๐ง

November 2, 2025

At NEPCON ASIA 2025 in Shenzhen, Ray Tech Malaysia’s parent company, Unicomp Technology Group showcased its latest AI + X-ray Intelligent Inspection innovations โ€” including Chinaโ€™s first 160kV nano-scale open-type X-ray source, marking a new milestone in semiconductor inspection technology.

From wafer-level to full-line inspection, Unicompโ€™s high-precision systems deliver micron-level accuracy, AI-driven automation, and end-to-end quality control for the semiconductor and electronics industries.

๐Ÿ’Ž Highlighted Solutions:

๐Ÿ”น AX9500 โ€“ Stand-alone 3D/CT inspection with 2000X magnification for wafer, MEMS, and advanced packaging defect detection.

๐Ÿ”น LX9200 โ€“ In-line 3D/CT system with high-penetration micro-focus X-ray source for complex, high-density modules.

๐Ÿ”น LX2000 โ€“ High-speed precision X-ray inspection with 9 integrated AI algorithms for real-time solder joint analysis.

๐Ÿ”น AX9100MAX โ€“ All-direction AI smart X-ray system for thick, dense, and large semiconductor products, ensuring zero-blindspot quality control.

During the show, Unicomp experts also hosted multiple technology sharing sessions, engaging visitors in discussions on how AI + X-ray innovations are shaping the future of semiconductor and electronics quality assurance.

Smart inspection, smarter manufacturing โ€” driving yield, reliability, and innovation forward.