From 25–27 March 2026, our parent company, Unicomp Technology (Group) Co., Ltd., proudly participated in Productronica China 2026 at the Shanghai New International Expo Centre, presenting next-generation inspection technologies for the rapidly evolving semiconductor industry.
As chip manufacturing enters the new era, conventional 2D inspection is no longer sufficient to detect complex internal defects. The Unicomp AX9500 rises to the challenge with its advanced 3D CT X-ray inspection technology, delivering deep structural insight for high-value components.
Key Features of the AX9500 include:
160kV open tube with 1µm focus spot for ultra-precise imaging
High-resolution detection area using FPD technology
3D CT scanning system for true volumetric inspection
CNC programming with high accuracy and repeatability
Enhanced user-friendly navigation system
Easy tracking function with multi-angle inspection
With the AX9500, manufacturers can achieve higher yield, superior quality control, and confident inspection for advanced semiconductor devices.