Ray Tech

๐”๐ง๐ข๐œ๐จ๐ฆ๐ฉ ๐’๐ก๐จ๐ฐ๐œ๐š๐ฌ๐ž๐ฌ ๐€๐๐ฏ๐š๐ง๐œ๐ž๐ ๐Ÿ‘๐ƒ ๐‚๐“ ๐—-๐‘๐š๐ฒ ๐ˆ๐ง๐ฌ๐ฉ๐ž๐œ๐ญ๐ข๐จ๐ง ๐š๐ญ ๐๐ซ๐จ๐๐ฎ๐œ๐ญ๐ซ๐จ๐ง๐ข๐œ๐š ๐‚๐ก๐ข๐ง๐š ๐Ÿ๐ŸŽ๐Ÿ๐Ÿ”

April 1, 2026

From 25โ€“27 March 2026, our parent company, Unicomp Technology (Group) Co., Ltd., proudly participated in Productronica China 2026 at the Shanghai New International Expo Centre, presenting next-generation inspection technologies for the rapidly evolving semiconductor industry.

As chip manufacturing enters the new era, conventional 2D inspection is no longer sufficient to detect complex internal defects. The Unicomp AX9500 rises to the challenge with its advanced 3D CT X-ray inspection technology, delivering deep structural insight for high-value components.

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Key Features of the AX9500 include:

โšก 160kV open tube with 1ยตm focus spot for ultra-precise imaging

โšก High-resolution detection area using FPD technology

โšก 3D CT scanning system for true volumetric inspection

โšก CNC programming with high accuracy and repeatability

โšก Enhanced user-friendly navigation system

โšก Easy tracking function with multi-angle inspection

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With the AX9500, manufacturers can achieve higher yield, superior quality control, and confident inspection for advanced semiconductor devices.