From May 20โ22, 2025, the Sands Expo & Convention Centre in Singapore will become the epicenter of semiconductor innovationโand weโre thrilled to invite you to Booth B2509 to meet our parent company, UNICOMP. Whether youโre an engineer, operations manager, or quality-control specialist, this is your chance to see first-hand how advanced X-ray inspection can elevate your production process.
Event Details
- When: May 20โ22, 2025 | 10:00 AMโ5:00 PM
- Where: Sands Expo & Convention Centre, Singapore
- Booth: B2509
About UNICOMP
UNICOMPโheadquartered in Wuxi, Chinaโis the parent company of Ray Tech Malaysia and a globally recognized leader in X-ray inspection technology. With a commitment to precision and reliability, UNICOMPโs systems serve a diverse range of industries:
- Semiconductors
- Electronics
- Automotive
- Die-casting
- Lithium-ion batteries
- LED manufacturing
- Solar photovoltaic modules
- Foreign Object Detection (FOD)
- Additive manufacturing & 3D printing
This international footprint has cemented UNICOMP as a hallmark brand in non-destructive testing and X-ray inspection worldwide.
What Weโre Showcasing
At SEMICON SEA 2025, UNICOMP will debut two flagship inspection systems designed to meet the most demanding production requirements:
1. CX3000 R2R
An inline X-ray solution optimized for counterfeit component detection on reel-to-reel assembly lines. Engineered for high throughput without compromising accuracy, the CX3000 R2R identifies hidden defects and ensures component authenticityโhelping you safeguard product quality and protect your brand.
2. AX8300S Plus
A 2.5D X-ray inspection system built for complex surface-mount technology (SMT) and printed circuit board assembly (PCBA) applications. With advanced imaging algorithms and precise defect-analysis tools, the AX8300S Plus delivers the insights you need to boost production reliability and reduce rework.
Why Visit Us?
- Live Demonstrations: See real-time X-ray imaging of your most challenging inspection tasks.
- Expert Consultations: Talk one-on-one with our engineers about how to integrate AI-driven X-ray solutions into your smart-manufacturing workflow.
- Networking Opportunities: Connect with industry peers and learn the latest trends in non-destructive testing.
Donโt miss this opportunity to explore the future of smart manufacturing. We look forward to welcoming you to Booth B2509โdrop by, say hello, and discover why UNICOMP is the global force in X-ray inspection technology!