On August 27, our team had the opportunity to visit the Johor Industrial Fair 2025 as guests — a valuable chance to see how the industry is tackling quality control challenges in electronics manufacturing, such as hidden solder defects, voids in BGAs , component misalignments, and micro-cracks in PCB assemblies .
At Ray Tech Malaysia, we’re proud to support these efforts with Unicomp’s advanced AI-powered X-Ray inspection systems , designed to meet diverse inspection needs across manufacturing scales:
𝐔𝐧𝐢𝐜𝐨𝐦𝐩 𝐀𝐗𝟕𝟗𝟎𝟎
A Compact X-Ray Inspection System optimized for mass production SMT lines. Equipped with AI algorithms, it efficiently detects defects in BGAs, QFNs, and solder joints — providing fast, reliable inspection to maintain production throughput without compromising quality.
𝐔𝐧𝐢𝐜𝐨𝐦𝐩 𝐀𝐗𝟖𝟐𝟎𝟎𝐌𝐚𝐱
A Versatile Offline Inspection System perfect for medium to high-volume PCB assembly lines. It offers comprehensive inspection capabilities for fine-pitch components, supporting real-time defect analysis and factory traceability integration for smart manufacturing.
𝐔𝐧𝐢𝐜𝐨𝐦𝐩 𝐂𝐗𝟑𝟎𝟎𝟎
A Compact Desktop X-Ray Inspection and Counter Machine suited for R&D labs, prototyping, and small-batch production. Its high-resolution imaging and user-friendly interface allow detailed inspection and failure analysis of PCBs and electronic modules.
𝐔𝐧𝐢𝐜𝐨𝐦𝐩 𝐀𝐗𝟗𝟏𝟎𝟎𝐌𝐚𝐱
A High End Industrial X-Ray System designed for large, thick, or dense electronic assemblies like power modules and automotive boards. Featuring a powerful X-Ray source (130kV), it delivers clear imaging for quality control of complex and large-format products.
These cutting-edge systems enable manufacturers to detect hidden defects early, improve yields, and ensure product reliability — all while embracing Industry 4.0 principles with AI-driven analytics and smart data management.
We’re excited about the future of electronics manufacturing and the role these technologies play in Malaysia’s industrial advancement!
